Kulicke & Soffa Industries, Inc. announced Q1 FY 2010 (ending Jan. 2) results yesterday, reporting net revenue of $128.4 million.

Known as a pioneering global leader in designing and manufacturing semiconductor production equipment, KLIC is well known throughout the industry for its packaging solutions, die and wedge bonding, as well as a growing range of tools for its core ball bonding products.

With a vast wealth of advanced technological process expertise under its belt, the Company is well-positioned to exploit future growth in the semiconductor industry, helping customers to produce next-generation semiconductor products while increasing value for its shareholders.

Chairman and CEO of KLIC Scott Kulicke spoke about the December quarter results, noting that they reflected “the continuing strong semiconductor industry recovery” and KLIC’s dedicated efforts to expand revenue via ball bonder offerings, the LED market, and an industry shift to copper wire bonding techniques.

Kulicke anticipates extant trends to continue well into and throughout the March fiscal quarter, resulting in revenue of $140-150 million.

Among other financial highlights was a return on investment capital of 35.4%, and total cash or equivalent of $175.2 million as of January 2, 2010.

Some key trends are also noteworthy; such as a 23% increase over September quarter in unit volumes of ball bonder units, and 146% increase to 1,550 in copper kit volumes in the same period.

Additionally, demand for heavy wire wedge bonders picked up late in the quarter and is anticipated to endure throughout the March quarter. Also of note was the first order for an iStackPSTM die bonder, occurring in January of this year.

A recording of the conference call held yesterday to go over these results is available at the KLIC corporate website.