The market continues to demand smaller form factor packages with enhanced reliability and lower cost for image sensor packaging. Tessera's SHELLCASE wafer-level chip-scale packaging (WLCSP) includes the latest advancements in image sensor packaging technology and delivers a highly reliable manufacturing solution for image sensors used in next-generation mobile devices including cell phones and PDAs.

"The continued demand for smaller, lower cost, surface mountable camera modules makes our SHELLCASE MVP solution the ideal packaging technology for Qtech's target customers: the manufacturers of cell phones and laptops," said Michael Bereziuk, executive vice president, Imaging & Optics, Tessera. "This latest generation SHELLCASE solution is not only the lowest cost and most reliable image sensor packaging technology we have ever released, but its small form factor - made possible through the use of through silicon via technology - makes it suitable for a wide range of camera module applications including cell phone cameras."

Qtech, based in China, manufactures compact camera modules for the worldwide cell phone, notebook computer and security and protection markets. More information can be found at www.qtechglobal.com.

"Tessera's SHELLCASE leading-edge wafer-level packaging technology will help us to successfully compete in the highly competitive, rapidly evolving global consumer electronics market," said Dr. Hao Zhou, CEO, Qtech. "With Tessera as our R&D provider for existing and future wafer-level packaging, our customers will increasingly benefit from Tessera's WLCSP technology with its stronger performance and lower cost."

About SHELLCASE

Tessera's industry-proven SHELLCASE wafer-level chip-scale packaging technology reduces costs and accelerates time-to-market. The packaging solution incorporates a thin layer of glass to cover image sensors at the wafer level. The cover glass protects the image sensors from contamination when the individual sensor die are diced and during subsequent camera module assembly stages. This significantly improves manufacturing yields, which are affected by contamination, and enables manufacturers to run lower-cost manufacturing assembly processes by avoiding the need for expensive clean room facilities.

A conventional WLCSP is an integrated circuit (IC) package with an area no greater than 1.2 times that of the IC and is mounted on the IC at the wafer level. The SHELLCASE MVP solution provides a WLCSP the same size of the IC. It is one of the industry's first to use through silicon vias (TSVs), which are vertical electrical connections passing through a silicon wafer or die. TSVs allow 3D die-stacking of the image sensor on another IC by vertically integrating two or more die with a dense, high-speed interface.

The SHELLCASE MVP solution does not require modification or re-layout of the image sensor wafer, as previous generations required. It was qualified to JEDEC - Level 1, making it highly reliable and suitable for a wide range of applications beyond cell phone cameras. As one of the thinnest solutions available on the market, it enables very low profile camera modules, providing OEMs with greater design flexibility.

About Tessera

Tessera Technologies, Inc. (Nasdaq:TSRA) is a leading provider of miniaturization technologies for the electronics industry. The company licenses its innovations, as well as delivers products based on these innovations to promote the development of the supply chain infrastructure, enabling manufacturers to get the right product to market, at the right time. Tessera is headquartered in San Jose, California. For information call 1.408.321.6000 or go to www.tessera.com.

Safe Harbor Statement

This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected. Material factors that may cause results to differ from the statements made include delays, setbacks or losses relating to our intellectual property or intellectual property litigations, or any invalidation or limitation of our key patents; fluctuations in our operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect our ability to protect our intellectual property; the risk of a decline in demand for semiconductor products; failure by the industry to adopt our technologies; competing technologies; the future expiration of our patents; the future expiration of our license agreements and the cessation of related royalty income; the failure or refusal of licensees to pay royalties; failure to achieve the growth prospects and synergies expected from acquisition transactions; and delays and challenges associated with integrating acquired companies with our existing businesses. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. Tessera's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended December 31, 2007 and its Quarterly Report on Form 10-Q for the quarter ended Sept. 30, 2008, include more information about factors that could affect the company's financial results.

Tessera, the Tessera logo and SHELLCASE are trademarks or registered trademarks of Tessera Inc. or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.