Speculations have been hinting that Apple is working on a variant of iPhone 7 that will feature a dual-camera setup. It is expected to launch with “iPhone 7 Pro” moniker. The schematics of the alleged iPhone 7 Pro smartphone have been revealed by Mac Fan, a Japanese magazine.
The leaked schematics show that there is a dual-camera setup on the rear side of the alleged iPhone 7 Pro. It does not feature a 3.5 mm audio jack, but it seems to house a new feature of Smart Connector, 9 to 5 Mac reported.
The rumor mill has been claiming since several months that Apple will be axing the 3.5 mm headphone jack to launch the iPhone 7 with a slimmer design. However, the leaked schematics have revealed that the form factor of the iPhone 7 Pro is almost similar to that of iPhone 6S Plus.
The thickness of iPhone 6S Plus is 7.1 mm. The schematics indicate that the iPhone 7 Pro will be a slightly thicker device as it measures 7.3 mm in thickness. One of the probable reasons as to why the iPhone 7 Pro has a thicker form factor is that features two iSight cameras. Since the 3.5 mm will be axed on the upcoming iPhone 7 models, these smartphones are expected to support headphone connectivity through their Lightning ports.
The three holes present on the backside of the device seem to belong to a Smart Connector. This feature may make it possible for users to connect docks and enhanced battery cases. Other rumors suggest that the three holes are meant for wireless charging.
Apple is expected to launch three models of iPhone 7 this year namely, iPhone 7, iPhone 7 Plus and iPhone 7 Pro. Rumors have also hinted that the upcoming iPhone 7 models will be featuring glass panels on its rear and front sides unlike the metallic design present on iPhone 6S and iPhone 6 models.