The rumor mill has been consistently talking about the design of the upcoming iPhone 7. Fresh Apple iPhone 7 rumors suggest that it will be coming with a very slim design like the iPhone 6 from 2014.
According to 9 to 5 Mac that cites new details on the iPhone 7 design through Macotakara, a Japanese tech blog, has stated that the thickness of the iPhone 7 is expected to be 6.1 mm. The iPhone 6 has a slim profile of 6.1 mm. Since the slim design of the iPhone 6 was met with bending issues, Apple had launched the iPhone 6S with a thicker chassis that measures 7.1 mm.
Speculations are also claiming that iPhone 7 will be coming with a waterproof chassis. However, the newest rumor indicates that it is likely to happen. However, the Japanese blog has stated the iPhone 7 will be sporting similar height and width as the iPhone 6 and iPhone 6S smartphones.
Apple has been criticized for use protruding cameras on its current iPhones. However, the iPhone 7 design rumors suggest that there will no camera bump on its rear panel. The slim design of the iPhone 7 will not be housing a 3.5 mm audio jack in a bid to cut down on its thickness.
The headphone jack will be replaced by an external speaker which means the topside of the iPhone 7 will house two sets of speakers. All the previous iPhone models have only one mono speaker. By this, the iPhone 7 will become the first iPhone to feature stereo speakers.
In order to reduce the thickness of the iPhone 7, Apple is likely to make use of slim-sized Lightning port. Rumors indicate that users will have to make use of wireless headphones from Beats to listen to the music on iPhone 7.
The iPhone 7 Plus rumors suggest that apart from the regular of the phablet Apple will also release a higher-end model called the iPhone Pro that will be equipped with dual cameras. The iPhone 7 and 7 Plus smartphones are expected to get announced in September this year.