The Apple logo inside the newest Apple Store in New York City's Grand Central Station
The Apple logo in the new Apple Store in New York City's Grand Central Station. Reuters

The rumor mill has been consistently spilling information on the speculated features and specs of the iPhone 7 and iPhone 7 Plus smartphones. Martin Hajek, a graphic designer, who is well-known for making 3D models of unreleased Apple devices, has created 3D renders of the upcoming iPhone 7 and iPhone 7 Plus smartphones.

Apple is rumored to launch the iPhone 8 in 2017 with overhaul improvements. However, the upcoming iPhone 7 and 7 Plus smartphones that are speculated to release in fall this year will be sporting a design that is quite similar to predecessor models.

Martin Hajek has created 3D renders of next generation iPhones based on the recent rumors and leaked schematics. He has also created concept models of protective cases for iPhone 7 models. Apple is expected to launch the iPhone 7 with a 4.7-inch screen and the iPhone 7 Plus with a 5.5-inch screen. Instead of using iPhone 7 Plus moniker, Hajek has called the next generation Apple phablet as iPhone 7 Pro.

The iPhone 7 and 7 Plus 3D renders created by Hajek do not feature 3.5 mm audio jack. The antenna bands are not present on the back panel like predecessor models. However, the antenna lines can be found on the top and bottom edge on the rear panel of both the devices. The iPhone 7 Pro can be sporting a dual camera system on its rear side.

Rumors have suggested that since the upcoming iPhones will not feature a 3.5 mm audio jack, the Cupertino company will include an additional external speaker on their bottom edges. However, the 3D renders built by Hajek shows the iPhone 7models with a single speaker.

Speculations are rife that the iPhone 7 models will be powered by Apple 10 chipset and they will be available in three storage choices of 32 GB, 128 GB and 256 GB. The iPhone 7 is expected to include 2 GB of RAM whereas the higher-end iPhone 7 Plus is rumored to arrive with 3 GB of RAM.