Jiu Yueting, co-founder of LeEco
Jia Yueting, co-founder and head of Le Holdings Co Ltd, also known as LeEco and formerly as LeTV, poses for a photo in front of a logo of his company after a Reuters interview at LeEco headquarters in Beijing, China, picture taken April 22, 2016. REUTERS/Jason Lee

LeEco is expected to become the first company to launch a Snapdragon 821 chipset powered flagship smartphone called Le Max 2 Pro. Speculations also indicate that it will also be the first smartphone to feature 8 GB of RAM. The smartphone featuring monstrous specs is expected to be unveiled on June 29.

The Snapdragon 821 chipset is said to be an overclocked edition of Snapdragon 820 chipset. It is expected to deliver a faster processing speed of 2.3 GHz along with Adreno 530 graphics, Phone Radar reported. As mentioned above, the SD 821 SoC will be supported by 8 GB of RAM.

The Le Max 2 Pro is expected to feature a 5.7-inch display that will carry support for Quad HD resolution of 2560 x 1440 pixels. The smartphone is expected to include a native storage of 128 GB. Its external storage is rumored to support up to 200 GB of microSD card.

For photography, the Le Max 2 Pro will be featuring a rear camera of 25-megapixel. The front side of the smartphone will be housing a selfie camera of 8-megapixel. The smartphone will not include a 3.5 mm audio jack. Instead it will allow users to connect wired headphones to its USB Type-C port.

The LeEco (previously known as LeTV) was the first company to announce a smartphone, the Le Max Pro, powered with Snapdragon 820 chipset at the Consumer Electronics Show (CES) 2016. And now it is rumored to become the first smartphone manufacturer to launch a Snapdragon 821 chipset smartphone.

LeEco has confirmed that it will begin the sales of its smartphones in the U.S. by fall this year. It is also expected to launch a video streaming service in the country. The company is expected to sell its smartphones unlocked in the U.S., Phone Scoop reported.